Improved Thermal Resistance and Electrical Conductivity of a Boron-Doped DLC Film Using RF-PECVD

Frontiers in Materials

Dong Chul Shin¹  Wanrong Li²  Yeong Min Park²  Xing Yan Tan²  Tae Gyu Kim³  Dae Weon Kim⁴ 

[1] Department of Mechanical Engineering, Koje College, Geoje, South Korea;Department of Nano Fusion Technology, Pusan National University, Busan, South Korea;Department of Nanomechatronics Engineering, Pusan National University, Busan, South Korea;School of Intelligent Automobile Engineering, Silla University, Busan, South Korea;

关键词: DLC;    boron-doped;    RF-PECVD;    thermal treatment;    electrical resistance;   

DOI  :  10.3389/fmats.2020.00201

来源: DOAJ

【 摘 要 】

Diamond-like carbon (DLC) film doped with boron has unique properties and displays higher thermal resistance, lower internal stress, and better electrical conductivity than un-doped DLC film; this makes it is suitable for various applications, especially in outer space. Radio-frequency plasma-enhanced chemical vacuum deposition of boron-doped DLC film was performed to determine the optimal percentage of boron for improving thermal resistance. Additional heat treatment and 40 vol% B2H6/CH4 yielded the best electrical conductivity. X-ray photoelectron spectroscopy, thermal gravimetric analysis, Raman spectroscopy, and the four-point probe method were utilized to analyze the properties of boron-doped DLC film. The boron-doped DLC film displayed outstanding performance in terms of thermal resistance and electrical conductivity.

【 授权许可】

Unknown