About «technological» properties of nano-sized nickel and copper films

Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов

E.V. Romanovskaia¹  H.N. Shimanskaya¹  M.S. Afanasiev²  A.S. Antonov³  D.V. Ivanov³  N.Yu. Sdobnyakov³ 

[1] Belarusian State Technological University;MIREA — Russian Technological University, Fryazino Branch of V.A. Kotelnikov Institute of Radio Engineering and Electronics of Russian Academy of Sciences;Tver State University;

关键词: scanning tunneling microscopy;    nanorelief;    fractal dimension;    nanoscale films of nickel and copper;    current-voltage characteristic;    tunnel contact;   

DOI  :  10.26456/pcascnn/2018.10.291

来源: DOAJ

【 摘 要 】

As an example of studying morphology of the relief of nickel and copper nano-sized films on the mica surface, it is possible to create a technology to «grow» structures with a given surface morphology using a scanning tunneling microscope. The characteristic features of the film surface nanorelief are described, including fractal properties. The current-voltage characteristics of a metal-to-metal contact for nickel and copper films with a tungsten tip are obtained. It is shown that for surface areas containing fractal structures, the current-voltage characteristics may differ from the dependences obtained on ordinary surfaces.

【 授权许可】

Unknown