Irregular Electrodeposition of Cu-Sn Alloy Coatings in [EMIM]Cl Outside the Glove Box with Large Layer Thickness

Coatings

Thomas Lampke¹  Lars Lehmann¹  Dominik Höhlich¹  Thomas Mehner¹ 

[1] Materials and Surface Engineering Group, Institute of Materials Science and Engineering, Faculty of Mechanical Engineering, Chemnitz University of Technology, Erfenschlager Straße 73, D-09125 Chemnitz, Germany;

关键词: Cu-Sn alloy;    ionic liquids;    aprotic solvents;    [EMIM]Cl;    electrodeposition;   

DOI  :  10.3390/coatings11030310

来源: DOAJ

【 摘 要 】

Thick Cu−Sn alloy layers were produced in an [EMIM]Cl ionic-liquid solution from CuCl₂ and SnCl₂ in different ratios. All work, including the electrodeposition, took place outside the glovebox with a continuous argon stream over the electrolyte at 95 °C. The layer composition and layer thickness can be adjusted by the variation of the metal-salts content in the electrolyte. A layer with a thickness of up to 15 µm and a copper content of up to ω_Cu = 0.86 was obtained. The phase composition was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray fluorescence (XRF). Furthermore, it was found that the relationship between the alloy composition and the concentration of the ions in the electrolyte is described as an irregular alloy system as according to Brenner. Brenner described such systems only for aqueous electrolytes containing complexing agents such as cyanide. In this work, it was confirmed that irregular alloy depositions also occur in [EMIM]Cl.

【 授权许可】

Unknown