Numerical Study on Heat Transfer in a Microchannel with Micro-fins

Applications of Modelling and Simulation

Kim Ho Yeap¹  Koon Chun Lai¹  Wei Long Yeo¹  Kok Seng Ong¹  Pei Song Chee² 

[1] Faculty of Engineering and Green Technology, Universiti Tunku Abdul Rahman, Kampar Campus, Malaysia;Lee Kong Chian Faculty of Engineering and Science, Universiti Tunku Abdul Rahman, Sungai Long Campus, Malaysia;

关键词: extended surface;    heat transfer enhancement;    microchannel heat sink;    micro-fins;    single phase flow;   

DOI  :  

来源: DOAJ

【 摘 要 】

We report an extended surface technique that utilises micro-fin arrays to enhance the heat transfer performance in the microchannels at Reynolds number ranging from 400 to 1000. Three different types of microfins namely Case A (cylindrical micro-fin), Case B (offset cylindrical micro-fin) and Case C (diverge cylindrical micro-fin) are designed. A comparative study between the three cases and bare rectangular microchannel was conducted. The technique enhances the thermal dissipation rate while keeping the pressure drop at a satisfactory level through proper design configurations. Numerical study has been performed in order to elucidate the single phase heat transfer phenomena in the present study.

【 授权许可】

Unknown