Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures

Micromachines

Shuai Zhang¹  Cheng Lu¹  Zekun Liu¹  Zhenhua Wu¹  Zhiyu Hu¹ 

[1] National Key Laboratory of Science and Technology on Micro-Nano Fabrication, Shanghai Jiao Tong University, Shanghai 200240, China;

关键词: thermoelectric;    Bi₂Te₃;    heterostructure;    interface;    metal;    oxide;   

DOI  :  10.3390/mi12050480

来源: DOAJ

【 摘 要 】

The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al₂O₃/Bi₂Te₃ heterostructures have been fabricated from bottom to up to optimize the thermoelectric power factor. The introducing metals can be alloyed with Bi₂Te₃ or form interstitials or dopants to adjust the carrier concentration and mobility. In addition, the metal-semiconductor interface as well as the metal-insulator-semiconductor interface constructed by the introduced metal and Al₂O₃ would further participate in the regulation of the carrier transport process. By adjusting the metal and oxide layer, it is possible to realize the simultaneous optimization of electric conductivity and Seebeck coefficient. This work will enable the optimal and novel design of heterostructures for thermoelectric materials with further improved performance.

【 授权许可】

Unknown