Studies on Curing Kinetics and Tensile Properties of Silica-Filled Phenolic Amine/Epoxy Resin Nanocomposite

Polymers

Ting Zheng¹  Xiaohong Zhang¹  Yi Ji¹  Yingjie Qiao¹  Xiaodong Wang¹  Yiwen Chen¹  Chengying Bai¹  Chunrui Lu² 

[1] School of Material Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China;School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;

关键词: cure kinetics;    tensile strength;    epoxy resin;    nanocomposite;   

DOI  :  10.3390/polym11040680

来源: DOAJ

【 摘 要 】

In this study, the curing kinetics of the phenolic amine/epoxy resin system were investigated by nonisothermal differential scanning calorimetry (DSC). The model-free isoconversional method of Ozawa–Flynn–Wall reveals a dependence of E_α (activation energy) on conversion (α), which interprets the autocatalytic curing reaction mechanism of the phenolic amine/epoxy resin system. Studies on the effects of nano-SiO₂ particles on the tensile properties and tensile fracture face morphology of nanocomposites show that the uniform dispersion of SiO₂ nanoparticles plays an important role in promoting the tensile performance of nanocomposites. Additionally, increases of 184.1% and 217.2% were achieved by adding 1.5% weight parts of nano-SiO₂ in composites for the tensile strength and tensile modulus, respectively.

【 授权许可】

Unknown