Modulators in Silicon Photonics—Heterogenous Integration & and Beyond

Photonics

Xing Dai¹  Frank H. Peters¹  Jack Mulcahy¹ 

[1] Physics Department, University College Cork, T12 XF62 Cork, Ireland;

关键词: modulator;    silicon photonics;    bonding;    III–V materials;    EAM;    EML;   

DOI  :  10.3390/photonics9010040

来源: DOAJ

【 摘 要 】

The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.

【 授权许可】

Unknown