Fracture and Embedment Behavior of Brittle Submicrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid Using a Scanning Electron Microscope Nanoindenter

Nanomaterials

Shoji Kamiya¹  Nobuyuki Shishido²  Naoto Koshizaki³  Daizen Nakamura³  Yoshie Ishikawa⁴ 

[1] Department of Electrical and Mechanical Engineering, Nagoya Institute of Technology, Nagoya 466-8555, Japan;Faculty of Science and Engineering, Kindai University, Higashiosaka 577-8502, Japan;Graduate School of Engineering, Hokkaido University, Sapporo 060-8628, Japan;Research Institute for Advanced Electronics and Photonics, National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba 305-8565, Japan;

关键词: pulsed laser melting in liquid;    spherical submicrometer particles;    particle fracture;    particle embedment;    Brinell hardness;    titanium carbide;   

DOI  :  10.3390/nano11092201

来源: DOAJ

【 摘 要 】

Generally, hard ceramic carbide particles, such as B₄C and TiC, are angulated, and particle size control below the micrometer scale is difficult owing to their hardness. However, submicrometer particles (SMPs) with spherical shape can be experimentally fabricated, even for hard carbides, via instantaneous pulsed laser heating of raw particles dispersed in a liquid (pulsed laser melting in liquid). The spherical shape of the particles is important for mechanical applications as it can directly transfer the mechanical force without any loss from one side to the other. To evaluate the potential of such particles for mechanical applications, SMPs were compressed on various substrates using a diamond tip in a scanning electron microscope. The mechanical behaviors of SMPs were then examined from the obtained load–displacement curves. Particles were fractured on hard substrates, such as SiC, and fracture strength was estimated to be in the GPa range, which is larger than their corresponding bulk bending strength and is 10–40% of their ideal strength, as calculated using the density-functional theory. Contrarily, particles can be embedded into soft substrates, such as Si and Al, and the local hardness of the substrate can be estimated from the load–displacement curves as a nanoscale Brinell hardness measurement.

【 授权许可】

Unknown