期刊论文详细信息
Advanced Science
Correlative AFM and Scanning Microlens Microscopy for Time‐Efficient Multiscale Imaging
Daojing Lin1  Xiaoduo Wang1  Yuechao Wang1  Zhu Liu1  Hao Luo1  Haibo Yu1  Jialin Shi1  Lianqing Liu1  Chanmin Su1  Tianyao Zhang1 
[1] State Key Laboratory of Robotics Shenyang Institute of Automation, Chinese Academy of Sciences Shenyang 110016 P. R. China;
关键词: atomic force microscopy (AFM);    correlative microscopy;    microlens;    microsphere;    optical imaging;   
DOI  :  10.1002/advs.202103902
来源: DOAJ
【 摘 要 】

Abstract With the rapid evolution of microelectronics and nanofabrication technologies, the feature sizes of large‐scale integrated circuits continue to move toward the nanoscale. There is a strong need to improve the quality and efficiency of integrated circuit inspection, but it remains a great challenge to provide both rapid imaging and circuit node‐level high‐resolution images simultaneously using a conventional microscope. This paper proposes a nondestructive, high‐throughput, multiscale correlation imaging method that combines atomic force microscopy (AFM) with microlens‐based scanning optical microscopy. In this method, a microlens is coupled to the end of the AFM cantilever and the sample‐facing side of the microlens contains a focused ion beam deposited tip which serves as the AFM scanning probe. The introduction of a microlens improves the imaging resolution of the AFM optical system, providing a 3–4× increase in optical imaging magnification while the scanning imaging throughput is improved ≈8×. The proposed method bridges the resolution gap between traditional optical imaging and AFM, achieves cross‐scale rapid imaging with micrometer to nanometer resolution, and improves the efficiency of AFM‐based large‐scale imaging and detection. Simultaneously, nanoscale‐level correlation between the acquired optical image and structure information is enabled by the method, providing a powerful tool for semiconductor device inspection.

【 授权许可】

Unknown   

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