Surface Characterization and Copper Release of a-C:H:Cu Coatings for Medical Applications

Coatings

Mareike Warkentin¹  Detlef Behrend¹  Krzysztof Rokosz²  Patrick Chapon³  Sofia Gaiaschi³  Marion Wienecke⁴  Jan Heeg⁴  Stefan Nißen⁴ 

[1] Department of Material Science and Medical Engineering, Faculty of Mechanical Engineering and Marine Technology, University of Rostock, 18051 Rostock, Germany;Division of BioEngineering and Surface Electrochemistry, Department of Engineering and Informatics Systems, Koszalin University of Technology, Racławicka 15-17, PL 75-620 Koszalin, Poland;HORIBA FRANCE S.A.S, Avenue de la Vauve-Passage Jobin Yvon, CS 45002-91120 Palaiseau, France;Institute of Surface and Thin Film Technology, Hochschule Wismar, Philipp-Mueller-Strasse 14, 23966 Wismar, Germany;

关键词: DLC;    copper filled;    ion release;    medical;    coating;    amorphous carbon;   

DOI  :  10.3390/coatings9020119

来源: DOAJ

【 摘 要 】

This paper focuses on the surface properties of a-C:H:Cu composite coatings for medical devices and how the release of Cu²⁺ ions from such coatings can be controlled. The released Cu ions have the potential to act as a bactericidal agent and inhibit bacterial colonization. A PVD⁻PECVD hybrid process was used to deposit a-C:H:Cu composite coatings onto Ti6Al4V substrates. We examine the layer surface properties using atomic force microscopy and static contact angle measurements. An increasing surface roughness and increasing contact angle of Ringer’s solution was measured with increasing copper mole fraction (X_Cu) in the coatings. The contact angle decreased when a supplementary bias voltage of −50 V was used during the a-C:H:Cu deposition. These findings are in line with earlier published results regarding these types of coatings. The release of Cu²⁺ ions from a-C:H:Cu coatings in Ringer’s solution was measured by anodic stripping voltammetry. Different layer structures were examined to control the time-resolved Cu release. It was found that the Cu release depends on the overall X_Cu in the a-C:H:Cu coatings and that an additional a-C:H barrier layer on top of the a-C:H:Cu layer effectively delays the release of Cu ions.

【 授权许可】

Unknown