Nanoscale precipitates evolution and strengthening mechanism of the aged Cu-Mg-Fe-Sn-P-Y electrical contact wire

Journal of Materials Research and Technology

Yong Liu¹  Yi Zhang¹  Yanlin Jia¹  Alex A. Volinsky²  Ming Fu²  Kexing Song³  Vladislav Yakubov⁴  Baohong Tian⁴  Bingjie Wang⁴ 

[1] Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang 471023, PR China;Corresponding authors.;School of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, PR China;School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, PR China;

关键词: Aging treatment;    Nanoscale precipitate;    Dispersion strengthening;    Orientation relationship;   

DOI  :  

来源: DOAJ

【 摘 要 】

The evolution and strengthening effect of nanoscale precipitates of the aged Cu-Mg-Fe-Sn-P-Y alloy were investigated via aging treatment in the 400–480 °C temperature range and the 10–480 min aging time range. Nanoscale γ-Fe particles uniformly distributed in the matrix caused dispersion strengthening in the peak-aging stage and transformed to α-Fe at the over-aging stage. The Mg3P2 secondary phase hindered the appearance of coarse Fe3P and formed definite orientation relationship (OR) of cubic to cubic with the Cu matrix after 480 min aging, <110>Cu||<110>Mg3P2, (002)Cu||(008)Mg3P2. The optimal aging parameter for the Cu-Mg-Fe-Sn-P-Y alloy is 60% cold deformation and aged at 460 °C for 20 min. The corresponding tensile strength is 599 MPa with the conductivity of 71.1%IACS and the elongation of 6.9%. Compared with the current contact wire, the ultimate tensile strength and conductivity of the studied alloy increased by 20% and 15%, respectively.

【 授权许可】

Unknown