Anodic Electrodeposition of Chitosan–AgNP Composites Using In Situ Coordination with Copper Ions

Materials

AliaksandrA. Kasach¹  Angelika Wrzesińska²  IrinaI. Kurilo³  Piotr Warszyński⁴  Małgorzata Zimowska⁴  DmitryS. Kharitonov⁴  Agnieszka Gibala⁴  Lilianna Szyk-Warszyńska⁴ 

[1] Department of Chemistry, Electrochemical Production Technology and Materials for Electronic Equipment, Chemical Technology and Engineering Faculty, Belarusian State Technological University, Sverdlova 13a, 220006 Minsk, Belarus;Department of Molecular Physics, Faculty of Chemistry, Lodz University of Technology, 90-924 Lodz, Poland;Department of Physical, Colloid and Analytical Chemistry, Organic Substances Technology Faculty, Belarusian State Technological University, Sverdlova 13a, 220006 Minsk, Belarus;Jerzy Haber Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, Niezapominajek 8, 30-239 Krakow, Poland;

关键词: chitosan;    copper;    electrodeposition;    composite;    AgNPs;    antibacterial properties;   

DOI  :  10.3390/ma14112754

来源: DOAJ

【 摘 要 】

Chitosan is an attractive material for biomedical applications. A novel approach for the anodic electrodeposition of chitosan–AgNP composites using in situ coordination with copper ions is proposed in this work. The surface and cross-section morphology of the obtained coating with varying concentrations of AgNPs were evaluated by SEM, and surface functional groups were analyzed with FT-IR spectroscopy. The mechanism of the formation of the coating based on the chelation of Cu(II) ions with chitosan was discussed. The antibacterial activity of the coatings towards Staphylococcus epidermidis ATCC 35984/RP62A bacteria was analyzed using the live–dead approach. The presented results indicate that the obtained chitosan–AgNP-based films possess some limited anti-biofilm-forming properties and exhibit moderate antibacterial efficiency at high AgNP loads.

【 授权许可】

Unknown