Fabrication of Micro-Patterned Surface for Pool-boiling Enhancement by Using Powder Injection Molding Process

Materials

Jungho Lee¹  Hanlyun Cho²  SeongJin Park²  Juan Godinez³  SeungMun You³  Dani Fadda³  JunSae Han⁴ 

[1] Department of Energy Conversion Systems, Korea Institute of Machinery and Materials, 156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Korea;Department of Mechanical Engineering, Pohang University of Science and Technology, 77 Cheongam-ro, Nam-gu, Pohang, Gyeongsangbuk-do 37673, Korea;Department of Mechanical Engineering, The University of Texas at Dallas, 800 W. Campbell Rd., Richardson, TX 75080, USA;Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials, 156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Korea;

关键词: powder injection molding;    copper micro-pattern;    pool boiling;    critical heat flux;    heat transfer coefficient;   

DOI  :  10.3390/ma12030507

来源: DOAJ

【 摘 要 】

In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern’s size was 100 μm, and the gap size was 50 μm. The short micro-pattern’s height was 100 μm, and the height of the tall one was 380 μm. A copper powder and wax-polymer-based binder system was used to fabricate the micro-patterned surfaces. The critical heat flux (CHF) and heat transfer coefficient (HTC) during pool-boiling tests were measured with the micro-patterned surfaces and a reference plain copper surface. The CHF of short and tall micro-patterned surfaces were 1434 and 1444 kW/m², respectively, and the plain copper surface’s CHF was 1191 kW/m². The HTC of the plain copper surface and the PIM surface with short and tall micro-patterned surfaces were similar in value up to a heat flux 1000 kW/m². Beyond that value, the plain surface quickly reached its CHF, while the HTC of the short micro-patterned surface achieved higher values than that of the tall micro-patterned surface. At CHF, the maximum values of HTC for the short micro-pattern, tall micro-pattern, and the plain copper surface were 68, 58, and 57 kW/m² K.

【 授权许可】

Unknown