Large Curvature Self-Folding Method of a Thick Metal Layer for Hinged Origami/Kirigami Stretchable Electronic Devices

Micromachines

Hiroki Yasuga¹  Tomohiro Tachi²  Kai Suto³  Yusuke Sato⁴  Eiji Iwase⁴  Atsushi Eda⁴  Takashi Sato⁴ 

[1] Faculty of Core Research, Ochanomizu University, 2-1-1 Otsuka, Bunkyo-ku, Tokyo 112-8610, Japan;Graduate School of Arts and Sciences, The University of Tokyo, 3-8-1 Komaba, Meguro-ku, Tokyo 153-8902, Japan;Nature Architects Inc., Akasaka, Minato-ku, Tokyo 107-0052, Japan;School of Fundamental Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan;

关键词: self-folding;    origami;    stretchable device;    flexible device;   

DOI  :  10.3390/mi13060907

来源: DOAJ

【 摘 要 】

A self-folding method that can fold a thick (~10 μm) metal layer with a large curvature (>1 mm⁻¹) and is resistant to repetitive folding deformation is proposed. Given the successful usage of hinged origami/kirigami structures forms in deployable structures, they show strong potential for application in stretchable electronic devices. There are, however, two key difficulties in applying origami/kirigami methods to stretchable electronic devices. The first is that a thick metal layer used as the conductive layer of electronic devices is too hard for self-folding as it is. Secondly, a thick metal layer breaks on repetitive folding deformation at a large curvature. To overcome these difficulties, this paper proposes a self-folding method using hinges on a thick metal layer by applying a meander structure. Such a structure can be folded at a large curvature even by weak driving forces (such as those produced by self-folding) and has mechanical resistance to repetitive folding deformation due to the local torsional deformation of the meander structure. To verify the method, the large curvature self-folding of thick metal layers and their mechanical resistance to repetitive folding deformation is experimentally demonstrated. In addition, an origami/kirigami hybrid stretchable electronic device with light-emitting diodes (LEDs) is fabricated using a double-tiling structure called the perforated extruded Miura-ori.

【 授权许可】

Unknown