Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Micromachines

Takafumi Fukushima¹  Tetsu Tanaka¹  Hideto Hashiguchi¹  Hisashi Kino²  Hiroshi Yonekura³  Ji-Chel Bea³  Mariappan Murugesan³  Kang-Wook Lee³  Mitsumasa Koyanagi³ 

[1] Department of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku University, 6-6-12 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Miyagi, Japan;Frontier Research Institute for Interdisciplinary Sciences, Tohoku University, Sendai 980-8579, Miyagi, Japan;New Industry Creation Hatchery Center (NICHe), Tohoku University, Sendai 980-8579, Miyagi, Japan;

关键词: multichip-to-wafer;    direct bonding;    capillary self-assembly;    liquid surface tension;    3D integration;    CMP;    heterogeneous integration;   

DOI  :  10.3390/mi7100184

来源: DOAJ

【 摘 要 】

Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapor deposition (PE-CVD) as a MCtW bonding interface was mainly employed, and in addition, wafer-to-wafer thermocompression direct bonding was also used for comparison. N2 or Ar plasmas were utilized for the surface activation. After plasma activation and the subsequent supplying of water as a self-assembly mediate, the chips with the PE-CVD oxide layer were driven by the liquid surface tension and precisely aligned on the host wafers, and subsequently, they were tightly bonded to the wafers through the MCtW oxide-oxide direct bonding technology. Finally, a mechanism of oxide-oxide direct bonding to support the previous models was discussed using an atmospheric pressure ionization mass spectrometer (APIMS).

【 授权许可】

Unknown