Field Modeling the Impact of Cracks on the Electroconductivity of Thin-Film Textronic Structures

Electronics

Stanisław Pawłowski¹  Jolanta Plewako²  Ewa Korzeniewska³ 

[1] Department of Electrodynamics and Electrical Machine Systems, Faculty of Electrical and Computer Engineering, Rzeszow University of Technology, 35-959 Rzeszow, Poland;Department of Power Electronics and Power Engineering, Faculty of Electrical and Computer Engineering, Rzeszow University of Technology, 35-959 Rzeszow, Poland;Institute of Electrical Engineering Systems, Faculty of Electrical Engineering, Electronics, Computer and Control Engineering, Lodz University of Technology, 90-924 Lodz, Poland;

关键词: thin films;    wearable electronics;    textronics;    cracks;    modeling of electroconductivity phenomena;    electroconductivity;    pvd;   

DOI  :  10.3390/electronics9030402

来源: DOAJ

【 摘 要 】

Wearable electronics are produced by depositing thin electroconductive layers with low resistance on flexible substrates. In the process of producing such metallic films, as well as during their usage, structural defects may appear which affect their electrical properties. In this paper, we present analytical and numerical models for understanding phenomena related to the electrical conductivity of thin electroconductive layers. The algorithm in the numerical model is based on the boundary integral equation method. The formulas enable calculation of the potential distribution and electric field strength of the analyzed structures, and describe the impact of cracks on their electrical resistance. The validity of the proposed models was verified by experimental results.

【 授权许可】

Unknown