Comparison of heat sink’s fin-spacing using CuO–H2O-based nanofluids for high heat generating microprocessor: an experimental study

Journal of Taibah University for Science

Muhammad Zubair Khan¹  Asif Israr¹  Muhammad Anwar¹  Ahmad Adnan Shoukat¹ 

[1] Institute of Space Technology;

关键词: Nanofluid;    optimization;    heat sinks;    thermal resistance;    overall heat transfer coefficient;   

DOI  :  10.1080/16583655.2018.1473945

来源: DOAJ

【 摘 要 】

Technological advancement in previous years has resulted in decrease in the size of microprocessors and thus, high heat generation. To address this problem, experiments were carried out to optimize the performance of nanofluid-cooled heat sinks at a power of 300 W for better thermal management. The optimization process involved varying both the concentration of the coolant (and by extension, its thermo-physical properties) and the fin spacing of the heat sink (to modify the convective and conductive heat transfer area) to achieve the lowest thermal resistance at different flow rates. Instead of an actual microprocessor, a copper block heated by a mica insulated clamp heater (rated at 285 W) was used to simulate the microprocessor. The evaluation of the heat sink performance was also based on the lowest base temperature achieved, the total heat rejected and the overall heat transfer coefficients for all iterations.

【 授权许可】

Unknown