Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint

Materials & Design

Xiao-Nan Wang¹  Xia Wei¹  Xiao-Xia Tang²  Qian Sun³  Jie Wang³  Kato Akira⁴  Peng-Cheng Huan⁴  Jia-Le Wang⁴  Hong-Shuang Di⁴ 

[1] Corresponding authors.;State Key Laboratory of Rolling and Automation, School of Materials Science and Engineering, Northeastern University, Shenyang, Liaoning 110819, PR China;MFLEX Yancheng Co.,Ltd, Yancheng, Jiangsu 224000, PR China;School of Iron and Steel, Soochow University, Suzhou, Jiangsu 215002, PR China;

关键词: Al/Cu dissimilar welding;    Laser soldering;    Surface modification;    Microstructure;    Mechanical properties;   

DOI  :  

来源: DOAJ

【 摘 要 】

Cu-based component/aluminum substrate solder joint is achieved through laser soldering technology in this paper. The solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum substrate laser soldering joint are studied. The results show that the presence of the high melting point Al2O3 oxide film (∼18.45 nm thickness) isolates the contact between the molten Sn-based solder and the aluminum substrate, which results in the poor wetting properties of aluminum substrate. The surface modification of aluminum substrate can significantly improve wettability (110°→14°). Anisotropic Sn dendrites appear in the brazing area of laser soldering joints, and Ag3Sn is precipitated in the β-Sn matrix. The (Cu, Ni)6Sn5 IMC is formed near the Ni layer side. Due to the extremely fast cooling rate, the IMC thickness is less than 5 μm, and a continuous (Cu, Ni)6Sn5 region with a thickness of less than 1 μm appears at the interface near the Ni layer side. The average maximum linear load of the laser soldering joints is 95.2 N/mm. The laser soldering joint fracture occurs along the brittle (Cu, Ni)6Sn5 IMC formed at the Ni layer interface, and the fracture mode is mainly ductile fracture.

【 授权许可】

Unknown