Effect of Temperature on the Deformation Behavior of Copper Nickel Alloys under Sliding

Materials

Manel Rodríguez Ripoll¹  StefanJ. Eder¹  Daniele Dini²  Carsten Gachot³  PhilippG. Grützmacher³ 

[1] AC2T Research GmbH, Viktor-Kaplan-Straße 2/C, 2700 Wiener Neustadt, Austria;Department of Mechanical Engineering, Imperial College London, South Kensington Campus, Exhibition Road, London SW7 2AZ, UK;Institute for Engineering Design and Product Development, TU Wien, Lehárgasse 6-Objekt 7, 1060 Vienna, Austria;

关键词: microstructure;    plastic deformation;    FCC alloys;    molecular dynamics;    sliding contact;   

DOI  :  10.3390/ma14010060

来源: DOAJ

【 摘 要 】

The microstructural evolution in the near-surface regions of a dry sliding interface has considerable influence on its tribological behavior and is driven mainly by mechanical energy and heat. In this work, we use large-scale molecular dynamics simulations to study the effect of temperature on the deformation response of FCC CuNi alloys of several compositions under various normal pressures. The microstructural evolution below the surface, marked by mechanisms spanning grain refinement, grain coarsening, twinning, and shear layer formation, is discussed in depth. The observed results are complemented by a rigorous analysis of the dislocation activity near the sliding interface. Moreover, we define key quantities corresponding to deformation mechanisms and analyze the time-independent differences between 300 K and 600 K for all simulated compositions and normal pressures. Raising the Ni content or reducing the temperature increases the energy barrier to activate dislocation activity or promote plasticity overall, thus increasing the threshold stress required for the transition to the next deformation regime. Repeated distillation of our quantitative analysis and successive elimination of spatial and time dimensions from the data allows us to produce a 3D map of the dominating deformation mechanism regimes for CuNi alloys as a function of composition, normal pressure, and homologous temperature.

【 授权许可】

Unknown