期刊论文详细信息
| Tekhnologiya i Konstruirovanie v Elektronnoi Apparature | |
| Devices for quality control of welded joints of leads of packageless chips | |
| 关键词: microassembly; quality control of microcircuit leads welding; | |
| DOI : | |
| 来源: DOAJ | |
【 摘 要 】
The author considers the design and operation of two devices for quality control of welded joints between aluminum leads of packageless microcircuits and contact pads of a thin-film circuit.
【 授权许可】
Unknown
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