A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration

IEEE Journal of the Electron Devices Society

卷:4

Yu-Chen Hu¹  Kuan-Neng Chen¹ 

[1] Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan;

关键词: Flexible substrate;    3D integration;    Fine-pitch application;    Bonding;   

DOI  :  10.1109/JEDS.2016.2537359

来源: DOAJ

【 摘 要 】

A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking.

【 授权许可】

Unknown