In-Situ Study of Dynamics of Refractive Index Changes in Silicon Devices Induced by UV-light Irradiation

IEEE Photonics Journal

卷:14

Huabin Qiu¹  Xuejin Li¹  Yuzhi Chen¹  Zhiwei Wei¹  Youfu Geng¹  Jiaqi Wang¹  Yu Du¹  Zhengkun Xing²  Zhenzhou Cheng² 

[1] College of Physics and Optoelectronic Engineering, Shenzhen University, Shenzhen, China;

[2] School of Precision Instrument and Optoelectronics Engineering, Tianjin University, Tianjin, China;

关键词: Silicon photonics;    photonic packing;    microring resonator;    integrated optics;    waveguide;    grating coupler;   

DOI  :  10.1109/JPHOT.2022.3181352

来源: DOAJ

【 摘 要 】

Silicon photonics has been studied in various areas by providing small-footprint, high-performance, and mass-producible optoelectronic components integrated on a chip. For the photonic packaging, ultraviolet (UV) curing techniques have been widely utilized. Meanwhile, silica cladding absorption to UV light could alter its refractive index (RI), affecting the optical testing of silicon devices during or after the device packaging. Therefore, it is significant to characterize the dynamics of RI changes induced by UV-light irradiation. However, the in-situ characterization of such devices is seldom explored. Here, we studied the influence of UV-light irradiation on silicon photonic devices by probing resonant wavelength shifts of a racetrack microring resonator. Specifically, we studied the temporary variation of the resonant wavelength and its recovery time under different UV-light exposure durations. Experimental results show that with a UV energy of 21 J/cm², the resonator had a maximum resonant wavelength shift of 0.31 nm, corresponding to an effective RI change of 0.0009 and recovering time of 95 minutes. Based on the experimental results, we compressively analyzed and compared RI changes induced by plasmon dispersion effect, thermal optical effect and photon-induced silica densification effect. Our study is expected to provide useful guidelines for in-situ silicon photonic testing and packaging.

【 授权许可】

Unknown