Rheological Behavior of Fugitive Organic Inks for Direct-Write Assembly

Applied Rheology

卷:17

White Scott R.¹  Lewis Jennifer A.²  Therriault Daniel³ 

[1] Beckman Institute for Advanced Science and Technology, Autonomic Materials Systems Group, Aerospace Engineering,University of Illinois at Urbana-Champaign, 306 Talbot Lab, 104 S. Wright St., Urbana, IL 61801, USA;

[2] Materials Science and Engineering Department, Frederick Seitz Materials Research Laboratory, NSF Center for Directed Assembly of Nanostructures, University of Illinois at Urbana-Champaign, 212d Ceramics Bldg., 1304 W. Green St., Urbana, IL 61801, USA;

[3] Mechanical Engineering Department, Center for Applied Research on Polymers and Composites (CREPEC), École Polytechnique de Montréal, Montréal, Québec H3C 3A7,Canada;

关键词: direct-write;    viscoelastic material;    organic ink;    structural behavior;    microfabrication;   

DOI  :  10.1515/arh-2007-0001

来源: DOAJ

【 摘 要 】

The rheological behavior of a fugitive organic ink tailored for direct-write assembly of 3D microfluidic devices is investigated. Rheological experiments are carried out to probe the shear storage and loss moduli as well as the complex viscosity as a function of varying temperature, frequency and stress amplitude. Master curves of these functions are assembled using time-temperature superposition. The fugitive ink, comprised of two organic phases, possesses an equilibrium shear elastic modulus nearly two orders of magnitude higher than that of a commercial reference ink at room temperature and a peak in the relaxation spectrum nearly six orders of magnitude longer in time scale. The self-supporting nature of extruded ink filaments is characterized by direct video imaging. Comparison of the experimentally observed behavior to numerical predictions based on Euler-Bernoulli viscoelastic beam analysis yield excellent agreement for slender filaments.

【 授权许可】

Unknown