Reliability Design about Release Holes in Beam of Fuze MEMS G-Switch

Sensors & Transducers

卷:178

Ya ZHANG¹  Xiaolin PAN¹  Bo LI¹ 

[1] School of Mechatronics Engineering, North University of China, Taiyuan, 030051, China;

关键词: MEMS G-Switch;    Release holes;    Reliability design;    Fuze microstructure.;   

DOI  :  

来源: DOAJ

【 摘 要 】

Fuze microstructures include micro acceleration switches, security mechanisms, which the key elements are the elastic elements, such as micro beams, micro springs. Micro material and structure of the elastic element will determine the mechanical properties of the Fuze microstructures. In this paper, optimization design is done for the micro cantilever beam in the Gravity Switches by SOI (silicon on insulator) wafer through design stress release square holes with 10um length of side, leads to an increase in sensitivity and a decrease in crack growth, which meet the requirements of the process reliability and working reliability.

【 授权许可】

Unknown