Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint

Materials

卷:11

MohdArif Anuar Mohd Salleh¹  XuanQuy Tran²  Kazuhiro Nogita³  Stuart D. McDonald³  Flora Somidin³  Syo Matsumura⁴  Hiroshi Maeno⁴ 

[1] Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis, Taman Muhibbah, Arau 02600, Malaysia;

[2] Department of Applied Quantum Physics and Nuclear Engineering, Kyushu University, Fukuoka 819-0395, Japan;

[3] Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane QLD 4072, Australia;

[4] The Ultramicroscopy Research Center, Kyushu University, Fukuoka 819-0395, Japan;

关键词: Cu₆Sn₅ intermetallic compound;    high-voltage transmission electron microscopy;    polymorphic phase transformation;    electron diffraction;    time-temperature transformation;   

DOI  :  10.3390/ma11112229

来源: DOAJ

【 摘 要 】

In-situ observations of the polymorphic transformation in a single targeted Cu₆Sn₅ grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu₃Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η′-Cu₆Sn₅ superlattice reflections appear in the hexagonal η-Cu₆Sn₅ diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η′-Cu₆Sn₅ contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.

【 授权许可】

Unknown