Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves

Chinese Journal of Mechanical Engineering

Wei Zhou¹  Qingyu Dong¹  Ding Yuan¹  Ting Fu² 

[1] Department of Mechanical and Electrical Engineering, Xiamen University, 361005, Xiamen, China;Key Laboratory of Metallurgical Equipment and Control Technology, Wuhan University of Science and Technology, 430081, Wuhan, China;

关键词: Microchannel;    Connected grooves;    Heat transfer enhancement;    Performance evaluation;   

DOI  :  10.1186/s10033-021-00632-w

来源: Springer

【 摘 要 】

To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface (type A) was designed. A comparative study of heat transfer was conducted regarding the performances of type A microchannels, microchannels embedded with grooves on their bottom (including types B and C), or on the sidewalls (type D) as well as smooth rectangular microchannels (type E) via a three-dimensional numerical simulation and experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that the average Nusselt number of types A, B, C, and D microchannels were 106, 73.4, 50.1, and 12.6% higher than that of type E microchannel, respectively. The smallest synergy angle β and entropy generation number Ns,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis, which indicated that type A exhibited the best heat transfer performance. Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients, which contributed to enhanced heat transfer performance.

【 授权许可】

CC BY