Development of seed layer deposition and fast copper electroplating into deep microvias for three-dimensional integration

Micro & nano letters

article

Xiao Chen¹  Gaowei Xu¹  Le Luo¹ 

[1] State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences;University of the Chinese Academy of Sciences

关键词: copper;    electron beam deposition;    electroplating;    elemental semiconductors;    integrated circuit interconnections;    integrated circuit packaging;    scanning electron microscopy;    silicon;    vacuum deposition;    three-dimensional integrated circuits;    vias;    seed layer deposition;    fast copper electroplating;    three-dimensional integration;    electron beam evaporation;    copper fast-filling;    deep vertical microvias;    multistep electroplating process;    single vertical TSV;    scanning electron microscope;    void-free microvias;    Si;    Cu;    copper;    electron beam deposition;    electroplating;    elemental semiconductors;    integrated circuit interconnections;    integrated circuit packaging;    scanning electron microscopy;    silicon;    vacuum deposition;    three-dimensional integrated circuits;    vias;    seed layer deposition;    fast copper electroplating;    three-dimensional integration;    electron beam evaporation;    copper fast-filling;    deep vertical microvias;    multistep electroplating process;    single vertical TSV;    scanning electron microscope;    void-free microvias;    Si;    Cu;   

DOI  :  10.1049/mnl.2012.0801

学科分类：计算机科学（综合）

来源: Wiley

【 摘 要 】

This paper describes a study carried out with K-12 students. This study is focused on understanding the motivation of these students on the use of robots in the Project Area curricular unit and to understand whether they want to continue their studies in technology areas. K-12 students participated in the RoboParty® event, where the main task is to assemble and program a robot. In other words, the students, in a simple and entertaining way and guided by qualified tutors, learned how to build a robot. At the end of the academic year, a questionnaire was applied to identify and evaluate the K-12 students' opinions regarding the experience. The students’ reaction to this experience as well to the direct contact with the university environment was quite positive.

【 授权许可】

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