Benzo-cyclo-butene bonding process with ‘stamp’ printing for wafer level package

Micro & nano letters

article

Wen Xia¹  Lei Li¹  Kangfa Deng¹  Song Li¹  Weiguo Su¹  Wei Zhang¹ 

[1] National Key Laboratory of Micro/Nano Fabrication Technology, Institute of Microelectronics;Peking University

关键词: organic compounds;    wafer bonding;    wafer level packaging;    curing;    tensile testing;    microswitches;    benzo-cyclo-butene bonding process;    stamp printing;    wafer level package;    three-dimensional structures;    bonding strength;    auxiliary wafer material;    precuring time;    bonding quality;    tensile bonding test;    acceleration microswitch;   

DOI  :  10.1049/mnl.2014.0137

学科分类：计算机科学（综合）

来源: Wiley

【 摘 要 】

Lumbosacral plexus entrapment syndrome (LPES) is a little-known but common cause of chronic lumbopelvic and lower extremity pain. The lumbar plexus, including the lumbosacral tunks emerge through the fibers of the psoas major, and the proximal sciatic nerve beneath the piriformis muscles. Severe weakness of these muscles may lead to entrapment plexopathy, resulting in diffuse and non-specific pain patterns throughout the lumbopelvic complex and lower extremities (LPLE), easily mimicking other diagnoses and is therefore likely to mislead the interpreting clinician. It is a pathology very similar to that of thoracic outlet syndrome, but for the lower body. This two-part manuscript series was written in an attempt to demonstrate the existence, pathophysiology, diagnostic protocol as well as interventional strategy for LPES, and its efficacy.

【 授权许可】

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