Development of hot embossing setup and fabrication of ordered nanostructures on large area of polymer surface for antibiofouling application

Micro & nano letters

article

Deepak Patil¹  Anagdha Sharma¹  Sivanandam Aravindan¹  Paruchuri Venkateswara Rao¹ 

[1] Department of Mechanical Engineering, Indian Institute of Technology Delhi

关键词: hydrophilicity;    atomic force microscopy;    nanofabrication;    wetting;    nanostructured materials;    polymer films;    embossing;    hydrophobicity;    shrinkage;    contact angle;    field emission scanning electron microscopy;    water droplet contact angle;    ordered nanostructures;    polymer surface;    nanostructured mould;    field emission scanning electron microscopy;    structured polystyrene thin film;    antibiofouling;    nanostructured polymeric thin film;    hot embossing;    pencil heaters;    thermostat;    thermocouple;    atomic force microscopy;    shrinkage defects;    wettability test;    goniometer;    hydrophilicity;    hydrophobicity;    plate counting method;   

DOI  :  10.1049/mnl.2018.5462

学科分类：计算机科学（综合）

来源: Wiley

【 摘 要 】

Ketoprofen is a non-steroidal anti-inflammatory (NSAID) drug with analgesic, anti-inflammatory, and antipyretic effects. It is widely used in the treatment of inflammation and pain associated with rheumatic disorders such as rheumatoid arthritis, osteoarthritis, and in soft tissue injury. The purpose of this study was to prepare an  oral disintegrating tablets of ketoprofen by simple method. The tablets were prepared by direct compression method and different ratios of various subliming agents or superdisintegrants were incorporated. Then these tablets were evaluated for hardness, friability, weight variation, water absorption ratio, disintegrating time and dissolution time. The results showed that Formula F11 batch had short disintegration time (18.0 sec) with good physical properties. This formula demonstrated a promised potentials for rapid absorption, improved bioavailability, effective therapy and patient compliance.

【 授权许可】

CC BY|CC BY-ND|CC BY-NC|CC BY-NC-ND