Modelling, microfabrication and performance evaluation of non-spiral planar microcoils for biomedical wireless power transfer systems

Micro & nano letters

article

Krishnapriya Sudhakaran¹  Rama Komaragiri²  Suja Krishnan Jagada¹ 

[1] Department of Electronics and Communication;Department of Electronics and Communication, Bennett University

关键词: inductive power transmission;    magnetic shielding;    microfabrication;    coils;    Bessel functions;    CMOS integrated circuits;    analytical model;    nonspiral microcoil;    electrical model;    nonspiral planar microcoil;    wireless power transfer link;    biomedical wireless power transfer applications;    microfabrication;    biomedical wireless power transfer systems;    mathematical modelling;    existing very-large-scale integration manufacturing process;    single mask level;    single metal level;    complementary metal oxide semiconductor sensing circuitry;   

DOI  :  10.1049/mnl.2019.0158

学科分类：计算机科学（综合）

来源: Wiley

【 摘 要 】

Microfabrication, electrical characterisation, and mathematical modelling of a non-spiral planar microcoil useful for wireless power transfer applications in biomedical devices are presented in this work. The fabrication method using the existing very-large-scale integration manufacturing process requires a single mask level, and a single metal level without any via enables direct integration with a complementary metal oxide semiconductor sensing circuitry. An analytical model of magnetic field distribution in a non-spiral microcoil is developed for the first time in this work, which satisfies the form of a Bessel function of the first kind. An electrical model of the non-spiral planar microcoil is also developed and compared with experimental results. Experimental results are in good agreement with the theoretical model. Based on the experimental results, using optimised coil geometry, a wireless power transfer link suitable for biomedical wireless power transfer applications is studied. The maximum possible value of coupling factor of the wireless link is found to be 60% for a small separation between the coil and the magnet whereas the minimum value of coupling factor is found to be below 10% for large separations. It is found that introducing Neodymium magnetic shield layer at the receiving coil enhances the coupling factor significantly.

【 授权许可】

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