期刊论文详细信息
Revista Brasileira de Ciência do Solo
Response of irrigated wheat cultivars to different nitrogen rates and sources
Marcelo Carvalho Minhoto Teixeira Filho2  Salatiér Buzetti1  Marcelo Andreotti1  Marco Eustáquio De Sá1  Orivaldo Arf1  Márcio Mohamed Megda1 
[1] ,Universidade Estadual Paulista Faculdade de Engenharia Ilha Solteira SP
关键词: Triticum aestivum L.;    savannah soil;    Entec;    urea;    grain yield;    yield components;    Triticum aestivum L.;    Cerrado;    Entec;    ureia;    produtividade de grãos;    componentes da produção;   
DOI  :  10.1590/S0100-06832009000500023
来源: SciELO
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【 摘 要 】

High wheat yields require good N fertilization management. The objective of this study was to evaluate the effects of different N applications at sowing using Entec (N source with nitrification inhibitor) and urea (traditional N source) at covering, on four wheat cultivars. The experiment was conducted in a randomized block design in a factorial scheme, with four replications, at the Experimental Station of the Faculdade de Engenharia de Ilha Solteira - UNESP, on a dystrophic, epi-eutrophic alic Red Latosol with loamy texture, formerly under savannah vegetation. Four N rates (0, 60, 120, and 180 kg ha-1) were tested, applied at sowing in the case of Entec and top-dressed 40 days after plant emergence in the case of urea, and the four wheat cultivars E 21, E 22, E 42, and IAC 370. The yield of the wheat cultivars E 21 and E 42 was highest. Plant height and lodging index of cultivar E 22 were greatest, with consequently lowest grain yield. There was no significant difference between Entec (applied at sowing) and urea (top-dressed) in terms of grain yield and yield components. Nevertheless, urea resulted in a higher N leaf content, and Entec in a larger number of undeveloped spikelets. High nitrogen rates influenced the hectoliter mass negatively, affecting wheat grain quality. Grain yield increased under N rates of up to 82 kg ha-1 N, through Entec applied at sowing or top-dressed urea.

【 授权许可】

CC BY   
 All the contents of this journal, except where otherwise noted, is licensed under a Creative Commons Attribution License

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