Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Sensors

Stefano Mariani¹  Aldo Ghisi¹  Alberto Corigliano¹ 

[1] Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Piazza Leonardo da Vinci 32, 20133 – Milano, Italy

关键词: inertial MEMS sensors;    impact-induced failure;    dynamic fracture;    multi-scale FE analysis;   

DOI  :  10.3390/s90100556

来源: mdpi

【 摘 要 】

Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.

【 授权许可】

CC BY   
© 2009 by the authors; licensee Molecular Diversity Preservation International, Basel, Switzerland.