Electrically and Thermally Conducting Nanocomposites for Electronic Applications

Materials

Wayne E. Jones¹  Jasper Chiguma²  Edwin Johnson¹  Ashok Pachamuthu³ 

[1] Chemistry Department, Binghamton University, Vestal Parkway East 13902, USA; E-Mail:;Materials Science and Engineering Program, Binghamton University, Vestal Parkway East 13902, USA; E-Mail:;Systems Science and Industrial Engineering Department, Binghamton University, Vestal Parkway East 13902, USA; E-Mail:

关键词: nanocomposites;    nanotubes;    electrical conductivity;    thermal conductivity;    percolation threshold;   

DOI  :  10.3390/ma3021478

来源: mdpi

【 摘 要 】

Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i) dispersion of carbon nanotubes in the polymer host, (ii) carbon nanotube-polymer interaction and the nature of the interface, and (iii) alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.

【 授权许可】

CC BY   
© 2010 by the authors; licensee Molecular Diversity Preservation International, Basel, Switzerland.