Acoustic Devices for Particle and Cell Manipulation and Sensing

Sensors

Yongqiang Qiu²  Han Wang²  Christine E. M. Demore²  David A. Hughes⁵  Peter Glynne-Jones¹  Sylvia Gebhardt³  Aleksandrs Bolhovitins²  Romans Poltarjonoks²  Kees Weijer⁴  Andreas Schönecker³  Martyn Hill¹ 

[1] Faculty of Engineering and the Environment, University of Southampton, Southampton, SO17 1BJ, UK; E-Mails:;Institute for Medical Science and Technology, University of Dundee, 1 Wurzburg Loan, Dundee DD2 1FD, UK; E-Mails:;Smart Materials and Systems, Fraunhofer Institute for Ceramic Technology and Systems, Winterbergstrasse 28, 01277 Dresden, Germany; E-Mails:;Cell and Developmental Biology, College of Life Sciences, University of Dundee, Dundee, DD1 4HN, UK; E‐Mail:;School of Engineering and Computing, University of the West of Scotland, Paisley, PA1 2BE, UK; E-Mail:

关键词: ultrasonic manipulation;    high frequency;    array;    piezocrystals;    screen-printing;   

DOI  :  10.3390/s140814806

来源: mdpi

【 摘 要 】

An emerging demand for the precise manipulation of cells and particles for applications in cell biology and analytical chemistry has driven rapid development of ultrasonic manipulation technology. Compared to the other manipulation technologies, such as magnetic tweezing, dielectrophoresis and optical tweezing, ultrasonic manipulation has shown potential in a variety of applications, with its advantages of versatile, inexpensive and easy integration into microfluidic systems, maintenance of cell viability, and generation of sufficient forces to handle particles, cells and their agglomerates. This article briefly reviews current practice and reports our development of various ultrasonic standing wave manipulation devices, including simple devices integrated with high frequency (>20 MHz) ultrasonic transducers for the investigation of biological cells and complex ultrasonic transducer array systems to explore the feasibility of electronically controlled 2-D and 3-D manipulation. Piezoelectric and passive materials, fabrication techniques, characterization methods and possible applications are discussed. The behavior and performance of the devices have been investigated and predicted with computer simulations, and verified experimentally. Issues met during development are highlighted and discussed. To assist long term practical adoption, approaches to low-cost, wafer level batch-production and commercialization potential are also addressed.

【 授权许可】

CC BY   
© 2014 by the authors; licensee MDPI, Basel, Switzerland.