Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Sensors

Kenji Okabe¹  Horagodage Prabhath Jeewan¹  Shota Yamagiwa¹  Takeshi Kawano¹  Makoto Ishida¹  Ippei Akita¹ 

[1] Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan;

关键词: wireless power transmission;    wafer-level packaging;    flip-chip bonding;    flexible substrate;    rectenna;   

DOI  :  10.3390/s151229885

来源: mdpi

【 摘 要 】

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

【 授权许可】

CC BY   
© 2015 by the authors; licensee MDPI, Basel, Switzerland.