Forced Convective Heat Transfer from a Channel between Vertical Electronic Circuit Boards

JOURNAL OF CHEMICAL ENGINEERING OF JAPAN

Xu Jiayu¹  Nobuyoshi Nakagawa¹  Kumi Shibui¹  Kunio Kato¹ 

[1] Department of Biological & Chemical Engineering, Gunma University

关键词: Forced Convection;    Heat Transfer;    Electronic Circuit Board;    Temperature Distribution;   

DOI  :  10.1252/jcej.29.960

来源: Maruzen Company Ltd

【 摘 要 】

References(5)Cited-By(1)Forced convection is sometimes employed in the cooling of electronic equipment operating at high heat dissipation rates. The heated electronic components are usually arranged evenly on the vertical circuit boards.To analyze the heat transfer of such electronic equipment, the forced convective heat transfer between two vertical parallel electronic circuit boards (ECBs) was investigated. The local heat transfer coefficient from the board was affected by the Reynolds number, the distance between the boards, and the distance from the channel entrance.Two empirical equations for calculating local Nusselt numbers for the heat transfer in a channel between vertical electronic boards were obtained. One was for an ECB surface with components, another was for its rear surface without components, and the range of Reynolds numbers was from 1500 to 9000.

【 授权许可】

Unknown