Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations

European Journal of Translational Myology

Adrien Debelle¹  Maxime Bosquet³  Antoine Nonclercq¹  Anne Vanhoestenberghe²  Sam Dehaeck¹  Benoit Scheid¹  Laura Hermans¹  Laurent Lonys¹ 

[1] Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles;Aspire Centre for Rehabilitation Engineering and Assistive Technology at University College London;E.C.A.M., at the Haute Ecole Léonard de Vinci, Brussels

关键词: Soft encapsulation;    Flexible electronics;    Electrical stimulation;   

DOI  :  10.4081/ejtm.2016.6298

学科分类：骨科学

来源: Pagepress

【 摘 要 】

In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.

【 授权许可】

Unknown