Structural characteristics of titanium coating on copper substrates

Bulletin of materials science

R Ramaseshan²  M Vijayalakshmi¹  S Saroja¹  Akash Singh¹  Arup Dasgupta¹  P Kuppusami¹  Pradyumna Kumar Parida¹ 

[1] Physical Metallurgy Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, India$$Physical Metallurgy Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, IndiaPhysical Metallurgy Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, India$$;Surface and Nanoscience Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, India$$Surface and Nanoscience Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, IndiaSurface and Nanoscience Division, Indira Gandhi Centre for Atomic Research, Kalpakkam 603 102, India$$

关键词: Coatings;    sputtering;    titanium;    interfaces;    X-ray diffraction;    electron microscopy.;   

DOI  :  

学科分类：材料工程

来源: Indian Academy of Sciences

【 摘 要 】

The growth characteristics of titanium films deposited on glass, silicon (100) and oxygen free high purity copper substrate using magnetron sputtering have been investigated using X-ray diffraction, electron microscopy and scratch indentation techniques. The study of interface between the titanium film and the substrate was carried out to determine coating thickness, as well as intermixing of the elements at the interface. Studies revealed that the interface is free from voids and intermixing of the film and the substrate. Microstructural and diffraction analysis showed that the Ti coating was polycrystalline and exhibited columnar growth. The Ti crystallite size varied between 24 and 58 nmdepending on the substrate. The thickness of the films were typically about 4 𝜇m. Scratch test indicated that the films are adherent and the first critical load to failure was observed to be 4.5 N ± 2 N.

【 授权许可】

Unknown