Influence of polymer additive molecular weight on surface and microstructural characteristics of electrodeposited copper

Bulletin of materials science

Sobha Jayakrishnan¹  R Manu¹ 

[1] Electroplating and Metal Finishing Technology Division, Central Electrochemical Research Institute, Karaikudi 630 006, India$$Electroplating and Metal Finishing Technology Division, Central Electrochemical Research Institute, Karaikudi 630 006, IndiaElectroplating and Metal Finishing Technology Division, Central Electrochemical Research Institute, Karaikudi 630 006, India$$

关键词: Metal;    coatings;    additive;    poly ethylene glycol;    atomic force microscopy;    microstructure.;   

DOI  :  

学科分类：材料工程

来源: Indian Academy of Sciences

【 摘 要 】

Electrodeposition of copper was done with different molecular weight (MW) polyethylene glycol (PEG) as an additive in the plating bath. The adsorbed layer formed of PEG and chloride ion (Cl^�?) in the presence of copper ions has a definite role in controlling the deposition mechanism and the coating characteristics. The adsorption behaviour and suppressor nature of PEG with different MW (200�??20000) on the physicochemical and the surface morphological features of the copper deposit were characterized. The results reveal that depending on the adsorption capacity of the intermediate complex, the deposit properties show gradation. There is a range of morphology with particular grain structure for different MW PEG addition. Grain size and the roughness decreased with increase in PEG MW. The concentration of Cl^�? ion in the plating bath is also significant in determining the deposit mechanism of the bath as revealed from the shift in cathodic potential. The adsorbing power of the complex depends not only on PEG MW but also on Cl^�? ion concentration. XRD analysis of the copper deposit obtained with low MW PEG showed (220) as the major plane and with high MW PEG the prominent orientation was (111) and (200).

【 授权许可】

Unknown