Molecular Dynamics Investigation of Cutting Force in Nanometric Cutting of Monocrystalline Silicon | Science Publications

American Journal of Nanotechnology

Y. H. Chen¹  F. Z. Fang¹  X. D. Zhang¹  X. T. Hu¹ 

关键词: Monocrystalline silicon;    cutting force;    Molecular Dynamics (MD);    material removal process;    cutting depth;    threshold cutting;    cutting tool;    Symmetry Parameters (CSP);    hydrostatic pressure;   

DOI  :  10.3844/ajnsp.2010.62.67

学科分类：材料工程

来源: Science Publications

【 摘 要 】

Problem statement: Ultra-precision machining of monocrystalline silicon has become tremendously important in microelectronic, micromechanical and optical element manufacturing and the mechanism of nanometric cutting monocrystalline silicon has been a focused research topic. Molecular Dynamics (MD) simulation is developed as an effective way for studying the material removal process at nanometric scale. Approach: Molecular Dynamics (MD) simulation of nanometric cutting is conducted on monocrystalline silicon with three dimensional diamond tool of 0

【 授权许可】

Unknown