期刊论文详细信息
American Journal of Nanotechnology | |
Molecular Dynamics Investigation of Cutting Force in Nanometric Cutting of Monocrystalline Silicon | Science Publications | |
Y. H. Chen1  F. Z. Fang1  X. D. Zhang1  X. T. Hu1  | |
关键词: Monocrystalline silicon; cutting force; Molecular Dynamics (MD); material removal process; cutting depth; threshold cutting; cutting tool; Symmetry Parameters (CSP); hydrostatic pressure; | |
DOI : 10.3844/ajnsp.2010.62.67 | |
学科分类:材料工程 | |
来源: Science Publications | |
【 摘 要 】
Problem statement: Ultra-precision machining of monocrystalline silicon has become tremendously important in microelectronic, micromechanical and optical element manufacturing and the mechanism of nanometric cutting monocrystalline silicon has been a focused research topic. Molecular Dynamics (MD) simulation is developed as an effective way for studying the material removal process at nanometric scale. Approach: Molecular Dynamics (MD) simulation of nanometric cutting is conducted on monocrystalline silicon with three dimensional diamond tool of 0
【 授权许可】
Unknown
【 预 览 】
Files | Size | Format | View |
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RO201912010141694ZK.pdf | 281KB | download |