期刊论文详细信息
| Drvna industrija | |
| The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives | |
| Mravljak, Maksimiljan1 Šernek, Milan1 | |
| [1] Biotehnički fakultet Sveučilišta u Ljubljani, Ljubljana, Slovenija | |
| 关键词: epoxy adhesives; gel point; loss modulus; rheology; storage modulus; | |
| DOI : | |
| 学科分类：农业科学（综合） | |
| 来源: Sveuciliste u Zagrebu | |
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【 摘 要 】
The curing process of three different epoxy adhesives, which are appropriate for bonding wood with metal, was characterized on the basis of their rheology. The rheological measurements were carried out using a TA Instruments ARES G2...
【 授权许可】
Unknown
【 预 览 】
| Files | Size | Format | View |
|---|---|---|---|
| RO201911300961249ZK.pdf | 226KB |  download |
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