On the design of a 3D optical interconnected memory system

IEICE Electronics Express

Huaxi Gu³  Ke Chen³  Kun Wang²  Yintang Yang¹  Kang Wang³ 

[1] School of Microelectronics, Xidian University;School of Computer Science and Technology, Xidian University;State Key Laboratory of ISN, Xidian University

关键词: optical interconnect;    memory system;    3D stacking;   

DOI  :  10.1587/elex.11.20140664

学科分类：电子、光学、磁材料

来源: Denshi Jouhou Tsuushin Gakkai

【 摘 要 】

References(6)In this letter, a multi-rank parallel accessing memory system based on 3D stacking and optical interconnection technologies is proposed. This proposed memory system can be a promising solution to future many-core system’s memory accessing bottleneck. Simulation results show that the proposed memory system yields the latency reduction of transactions and enhancement of bandwidth effectively. The worst case latency of 4 ranks and 8 ranks proposed memory system can be 1/3 and 1/5 that of the electronic bus-based ones. Bandwidth enhancement of 4 ranks and 8 ranks proposed memory system can be 3.5 times and 4 times higher than that of the traditional bus-based ones.

【 授权许可】

Unknown