A NOVEL INTERCONNECT STRUCTURE FOR ELMORE DELAY MODEL WITH RESISTANCE-CAPACITANCE-CONDUCTANCE SCHEME | Science Publications

American Journal of Applied Sciences

Uma Ramadass¹  P. Dhavachelvan¹  Jebashini Ponnian¹  Krishnappriya¹ 

关键词: Elmore Delay;    RCG Interconnect;    RLC Network;    Figure of Merit;    Damping Ratio;   

DOI  :  10.3844/ajassp.2013.881.892

学科分类：自然科学（综合）

来源: Science Publications

【 摘 要 】

In this brief, we present a simple close-form delay estimate, based on first and second order moments that handle arbitrary voltages and conductance effects for a lumped and distributed line. This proposed model introduces a simple tractable delay formula by incorporating conductance (G) into Resistance, Capacitance (RC) network by preserving the characteristics of the Elmore delay model. The RCG model attains quick steady state condition and the accuracy of the interconnect delay estimates can be improved by deploying the conductance effect. The simulation results shows the proposed interconnect scheme performance is better than the existing in terms of delay, power and the figure of merit. The performance analysis depicts that the proposed scheme has improved its figure of merit with minimum and maximum of 21.12% and 49.13%. The analysis is validated through extensive simulations on a 250 nm CMOS technology.

【 授权许可】

Unknown