期刊论文详细信息
Metalurgija
Study of interaction between copper and melt of lead-free solders
Drápala, J.2  Jopek, P.2  Kubíček, P.1  Kostiuková, G.2 
[1] Ostrava-Hrabůvka, Czech Republic;Technical University of Ostrava; Faculty of Metallurgy and Materials Engineering; Ostrava-Poruba
关键词: lead-free solders;    copper;    tin;    silver;    intermetallic compounds;    diffusion;   
DOI  :  
学科分类:金属与冶金
来源: Hrvatsko Metalursko Drustvo
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【 摘 要 】

Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt is presented for the case of planar...

【 授权许可】

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