Study of interaction between copper and melt of lead-free solders

Metalurgija

Drápala, J.²  Jopek, P.²  Kubíček, P.¹  Kostiuková, G.² 

[1] Ostrava-Hrabůvka, Czech Republic;Technical University of Ostrava; Faculty of Metallurgy and Materials Engineering; Ostrava-Poruba

关键词: lead-free solders;    copper;    tin;    silver;    intermetallic compounds;    diffusion;   

DOI  :  

学科分类：金属与冶金

来源: Hrvatsko Metalursko Drustvo

【 摘 要 】

Problems of reactive diffusion at the interface solid phase - melt were studied theoretically and experimentally. A theoretical description of the kinetics of dissolution of the solid phase in the melt is presented for the case of planar...

【 授权许可】

Unknown