PROCESS PARAMETERS IN GRINDING OF Si3N4 CERAMICS WITH VIRTRIFIED BOND DIAMOND GRINDING WHEEL

Digest Journal of Nanomaterials and Biostructures

Z. H. Ji¹ 

关键词: Grinding;    Silicon nitride ceramics;    Vi r trified bond diamond grinding wheel;    Removal rate of grinding;    Roughness;   

DOI  :  

学科分类：生物技术

来源: Institute of Materials Physics

【 摘 要 】

Silicon nitride ceramics are known as "allround champions" in ceramic materials, butexcellent performance has also brought great difficulties to the grinding process. In thispaper, we use virtrified bond diamond grinding wheels to grind silicon nitride ceramics.The effects of grinding wheel line speed (v), diamond abrasive grain size, and grindingwheel feed (fr) on the removal rate of grinding and surface roughness of silicon nitrideceramics were researched. The results show that the overall grinding rate of silicon nitrideceramics increases with the wheel line speed. The coarse diamond abrasive particle sizeand greater feed lead to higher grinding rate, while the finer diamond abrasive result inbetter processed surface. By optimizing parameters of grinding parameters, the grindingefficiency and accuracy of silicon nitride ceramics are greatly improved. Finally, thegrinding rate of silicon nitride ceramics is as high as 0.4528 g/min, and the su rfaceroughness (unpolished) is 0.554μm after grinding.

【 授权许可】

Unknown