The Grinding Influence on the Strength of Fan-Out Wafer-Level Packages

International Journal of Information Technology

Z. W. Zhong ; C. Xu ; W. K. Choi

关键词: FOWLP strength;    surface roughness;    three-point bending;    grinding.;   

DOI  :  10.1999/1307-6892/10008773

学科分类：计算机应用

来源: World Academy of Science, Engineering and Technology (W A S E T)

【 摘 要 】

To build a thin fan-out wafer-level package, the package had to be ground to a thin level. In this work, the influence of the grinding processes on the strength of the fan-out wafer-level packages was investigated. After different grinding processes, all specimens were placed on a three-point-bending fixture installed on a universal tester for three-point-bending testing, and the strength of the fan-out wafer-level packages was measured. The experiments revealed that the average flexure strength increased with the decreasing surface roughness height of the fan-out wafer-level package tested. The grinding processes had a significant influence on the strength of the fan-out wafer-level packages investigated.

【 授权许可】

Unknown