期刊论文详细信息
Bulletin of Materials Science
Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications
SOO-JIN PARK^31  FAN-LONG JIN^22  DONG-JIN LEE^13 
[1]Department of Chemistry, Inha University, Nam-Gu, Incheon 402-751, Republic of Korea^3
[2]Department of Polymer Materials, Jilin Institute of Chemical Technology, Jilin City 132022, People’s Republic of China^2
[3]Nano Technology Inc., Daedeok-Gu, Daejon 306-801, Republic of Korea^1
关键词: Cu;    nanoparticles;    nanopowders;    electrical conductivity.;   
DOI  :  
学科分类:材料工程
来源: Indian Academy of Sciences
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【 摘 要 】
In the present study, Cu colloidal nanoparticles and nanopowders were successfully synthesized by a pulsed wire evaporation process. Cu-based nano-inks were prepared by mixing Cu nanoparticles with acrylic resin and solvent.Cu nanoparticles with a particle size of <20 nm were uniformly dispersed in ethylene glycol. The Cu nanopowders were successfully coated with an organic solvent composed of a hydrocarbon compound. This organic coating effectively inhibited the oxidation of Cu nanopowders. In addition, the stability of dispersion of Cu nanoparticles in the inks was improved by a ball-milling process. The electrical conductivity of the prepared Cu nano-inks was 10–28 $\mu$S cm$^{−1}$ for 20–40 wt% of Cu.
【 授权许可】

CC BY   

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