期刊论文详细信息
Bulletin of Materials Science | |
Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications | |
SOO-JIN PARK^31  FAN-LONG JIN^22  DONG-JIN LEE^13  | |
[1]Department of Chemistry, Inha University, Nam-Gu, Incheon 402-751, Republic of Korea^3 | |
[2]Department of Polymer Materials, Jilin Institute of Chemical Technology, Jilin City 132022, People’s Republic of China^2 | |
[3]Nano Technology Inc., Daedeok-Gu, Daejon 306-801, Republic of Korea^1 | |
关键词: Cu; nanoparticles; nanopowders; electrical conductivity.; | |
DOI : | |
学科分类:材料工程 | |
来源: Indian Academy of Sciences | |
【 摘 要 】
In the present study, Cu colloidal nanoparticles and nanopowders were successfully synthesized by a pulsed wire evaporation process. Cu-based nano-inks were prepared by mixing Cu nanoparticles with acrylic resin and solvent.Cu nanoparticles with a particle size of <20 nm were uniformly dispersed in ethylene glycol. The Cu nanopowders were successfully coated with an organic solvent composed of a hydrocarbon compound. This organic coating effectively inhibited the oxidation of Cu nanopowders. In addition, the stability of dispersion of Cu nanoparticles in the inks was improved by a ball-milling process. The electrical conductivity of the prepared Cu nano-inks was 10â28 $\mu$S cm$^{â1}$ for 20â40 wt% of Cu.【 授权许可】
CC BY
【 预 览 】
Files | Size | Format | View |
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RO201910258530168ZK.pdf | 1666KB | download |