Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components

Proceedings

Albrecht, Björn¹  Elsobky, Mourad²  Alavi, Golzar³  Deuble, Thomas⁴ 

[1] Author to whom correspondence should be addressed.;Institut für Mikroelektronik Stuttgart (IMS CHIPS), 70569 Stuttgart, Germany;Institut für Nano- und Mikroelektronische Systeme (INES), 70569 Stuttgart, Germany;Presented at the Eurosensors 2018 Conference, Graz, Austria, 9–12 September 2018

关键词: flexible electronics;    Hybrid System-in-Foil;    sensor systems;    ultra-thin chips;    humidity sensors;    near-field communication;    organic electronics;   

DOI  :  10.3390/proceedings2130748

学科分类：社会科学、人文和艺术（综合）

来源: mdpi

【 摘 要 】

Hybrid System-in-Foil exploits the complementary benefits of integrating embedded silicon chips with on-foil passive and active electronic components. In this work, the design, fabrication and characterization of three on-foil components, namely a humidity sensor, near field communication antenna and organic thin-film transistors, are investigated.

【 授权许可】

CC BY