Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations

Basic and applied myology

Anne Vanhoestenberghe¹  Maxime Bosquet²  Adrien Debelle³  Antoine Nonclercq³  Sam Dehaeck³  Laura Hermans³  Benoit Scheid³  Laurent Lonys³ 

[1] Aspire Centre for Rehabilitation Engineering and Assistive Technology at University College London;E.C.A.M., at the Haute Ecole Léonard de Vinci, Brussels;Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles

关键词: Soft encapsulation;    Flexible electronics;    Electrical stimulation;   

DOI  :  10.4081/ejtm.2016.6298

学科分类：农业科学（综合）

来源: Pagepress

【 摘 要 】

In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.

【 授权许可】

CC BY