Mechanical and thermal properties of epoxy composite thermal insulators filled with silica aerogel and hollow glass microspheres; pp. 339–346

Estonian Academy of Sciences. Proceedings

Mikk Vahtrus¹ 

关键词: hermal insulator;    epoxy composite;    aerogel;    hollow glass microspheres;    adhesion;    polymer testing methods and devices;    finite element method.;   

DOI  :  10.3176/proc.2017.4.03

学科分类：化学（综合）

来源: Teaduste Akadeemia Kirjastus

【 摘 要 】

Hydrophobic silica aerogel powder and hollow glass microspheres (HGM) were used as fillers for an epoxy adhesive to improve its thermal insulator properties. At 50 wt% of HGM content, the thermal conductivity of the HGM/epoxy composite decreased from 0.182 W/m·K to 0.104 W/m·K. The aerogel/epoxy composite, on the contrary, showed a slight increase in its thermal conductivity, most probably due to the filling of aerogel pores with the epoxy adhesive. Furthermore, it was shown that adhesion values of epoxy composites increase with the addition of aerogel and decrease when HGM was used as the filler material. Realistic numerical finite element method simulations revealed an increase in thermal isolation properties for both HGM/epoxy and aerogel/epoxy composites.

【 授权许可】

CC BY-NC